3GW Solar Module Manufacturing Facility — Breaking Ground 2026 · Make in India
Six precision stages — from raw silicon feedstock to certified, ready-to-deploy solar components.
Manufacturing Stages
01
Ingot Growth
Silicon Crystal Growing
Polysilicon melted and Czochralski-pulled at 1,420°C. 40-hour controlled growth cycle with precise crystal orientation and resistivity management.
02
Wafer Slicing
Diamond-Wire Cutting
Diamond-wire cut into ≤180μm wafers, cleaned in ultrapure water, EL-inspected, and sorted by resistivity grade for optimal downstream matching.
03
Cell Fabrication
TOPCon Processing
Texturisation, phosphorus diffusion, tunnel oxide deposition, PECVD AR coating, and silver/aluminium metallisation. Each cell flash-tested individually.
04
Module Assembly
Lamination & Framing
Cells tabbed with bus bar ribbons, laid on low-iron glass with EVA encapsulant, vacuum-laminated, framed, and fitted with junction boxes.
05
Quality Testing
IEC 61215 / 61730 Testing
Flash testing, EL imaging, thermal cycling (−40°C to +85°C × 200 cycles), damp-heat 1000hr, hail impact, and PID resistance verification.
06
Dispatch
Certified Global Dispatch
Unique serial numbers, IEC 62759-compliant packaging, quality certificates, test reports, and performance warranty documentation with every order.
Manufacturing Stages
01
Ingot Growth
Silicon Crystal Growing
High-purity polysilicon is melted at approximately 1,420°C and transformed into mono-crystalline silicon ingots through the advanced Czochralski (CZ) crystal growth process. Automated thermal control systems ensure precise crystal orientation, uniform resistivity, and ultra-low impurity levels essential for high-efficiency N-Type TOPCon applications.
1,420°C process
40-hr growth cycle
Czochralski method
02
Wafer Slicing
Diamond-Wire Cutting
Mono-crystalline ingots are precision sliced into ultra-thin wafers using advanced high-speed diamond-wire cutting technology. The wafers undergo ultrapure water cleaning, EL inspection, thickness calibration, and resistivity-based grading to ensure maximum downstream cell efficiency and manufacturing consistency.
≤130µm wafers
EL inspection
03
Cell Fabrication
TOPCon Processing
Wafers undergo advanced photovoltaic cell processing including texturisation, phosphorus diffusion, tunnel oxide passivation, PECVD coating, laser edge isolation, and precision silver/aluminium metallisation. Each cell is individually flash-tested to ensure superior conversion efficiency and long-term performance reliability.
25%+ cell efficiency
PECVD coating
04
Module Assembly
Lamination & Framing
High-efficiency TOPCon cells are interconnected using precision Busbar & Ribbons and integrated with high transmission low-iron Solar Glass and Encapsulants. The modules undergo vacuum lamination, framing, curing, and junction box integration under automated production environments.
16BB high-density interconnection design
Vacuum lamination
05
Quality Testing
IEC 61215 / 61730 Testing
Every module undergoes rigorous multi-stage testing and reliability validation based on international IEC standards to ensure superior electrical performance, durability, and long-term operational stability under extreme environmental conditions.
IEC 61215
IEC 61730 (Part-1 & Part-2)
06
Dispatch
Certified Global Dispatch
Each module is digitally traceable through unique serialisation and QR-based tracking systems, supported by quality certificates, test reports, and warranty documentation. Advanced packaging systems ensure safe global transportation and long-term product protection.
IEC 62759
Serial tracked
Quality First
Every solar module compliant as per IEC 61215, IEC 61730, BIS, and ALMM requirements. Zero-defect policy across all manufacturing stages.